Friday, September 16, 2022
Thursday, September 7, 2023
Friday, September 16, 2022
Monday, November 13, 2023
()的气体源中一般包含H+,C+,B+,Cl+,O+等离子。A、Cl2B、BCl3C、CO2D、H2...
Monday, November 13, 2023
Friday, September 16, 2022
Sunday, April 28, 2024
下面哪一种薄膜工艺中底材会被消耗()。A、薄膜沉积B、薄膜成长C、蒸发D、溅射...
Saturday, January 20, 2024
Friday, September 16, 2022
Saturday, January 20, 2024
如果磷在二氧化硅中扩散,对扩散率影响最大的因素是:()。A、扩散剂总量B、压强C、温度D、浓度...
Saturday, January 20, 2024
金相学的研磨之所以会在研磨面上造成如刮伤般的痕迹是由于在制程中()。A、氧化铬磨料溶水制成的研磨液B、使用羊毛研磨垫C、采用旋转研磨垫加压的方法D、无法必免的机械损耗...
Sunday, April 28, 2024
Saturday, October 28, 2023
Tuesday, March 12, 2024
thermal conductivity gauge的意思是()。A、离子计B、热传导真空计C、放电型真空计D、麦克劳式真空计...
Saturday, May 27, 2023
Monday, August 7, 2023
工艺文件的电子文档化要注意哪些问题?怎样才能保证工艺文件的电子文档是安全可靠的?...
Thursday, September 7, 2023
在集成电路工艺中,光复制图形和材料刻蚀相结合的工艺技术是()。A、刻蚀B、氧化C、淀积D、光刻...
Saturday, October 28, 2023